อุตสาหกรรมที่ใช้งาน

Fully-Automatic Wafer Test-and-Sorting Machine

คุณสมบัติเครื่องจักร

1. Fully‑automatic loading and unloading; processed by high‑speed rotary motor with an hourly output up to 8,000 pieces

2. 24 horizontally‑mounted nozzles with independent control for each unit, and a 4×4 nozzle layout in the vertical direction

3. 4 sorting bins，electrical testing function equipped,  multiple‑time bin classification supported

4. High‑precision AOI inspection system

5. Built‑in MES module for full‑lifecycle traceability of product data


อุตสาหกรรมที่ใช้งาน

The equipment is primarily adopted for wafer‑level testing and post‑packaging test procedures. It evaluates chip performance and quality so that the qualified chips can be proceeded to subsequent packaging workflows. Main inspection items cover electrical indicators and AOI wafer inspection.

Inspected wafers are graded and then placed inside trays for packaging. It serves chip testing for high‑end sectors including industrial, automotive and aerospace industries.


อุตสาหกรรมเซมิคอนดักเตอร์
Technical Data Sheet

Machine   Model

Fully-Automatic Wafer Test-and-Sorting Machine

Inspection   Function

Six‑sided   inspection

Placement   Accuracy

±100um

Number   of Bins

4 Bins   (A / B / C / D)

Loading   Method

Automatic   wafer loading

Unloading   Method

Tray,   waffle pack, etc.

Wafer   Size

4",   6", 8", 12"

Die Size

0.5x0.5   mm to 30.0x30.0mm

Die   Thickness

0.1mm   up to 1.5 mm

UPH

8K-24K

Testing   Function

Supported

Secondary   Bin Sorting

Supported

Infrared   Optical System

Supported


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